Hardware Reference
In-Depth Information
3000
SH-X2/X3
Cortex-A8/A9
MIPS 4Kc
SH-X
VR4122
VR4131
XScale
Atom
ARM11
1000
SH3-DSP
C64+
MIPS 5Kc
FR-V
PPC401GF
Cavium
MIPS 20Kc
300
VR4121
VR5500
TM5400
PPC750FX
ARM710
SH-4
ARM10
Niagara
3
rd
G SPARC
PPC403GA
ARM9
CF5307
Merom
TM3120
SH-3
SA110
PAsemi
PPC405CR
100
VR5432
MobilePentium III
PPC750GX
Opteron
CF5202
V851
POWER6
Ultra IIe
Itanium
SPARC v9
i960JT
SH-2
R16000
PPC750
PPC970
EC603e
R14000
Pentium4
30
POWER4+
Xeon
PPC7400
Pentium III
Xeon
Ultra II
Pentium II
POWER5
Athlon
R12000
POWER4
POWER3
Alpha 21164
Itanium2
—'98—'03—
10
Embedded
Server/PC
PA8500
PA8600
Pentium Pro
Ultra III
PA8800
Ultra
Alpha 21364
Itanium
Alpha 21264
PA8000
R10000
30
100
300
1000
3000
Operating Frequency (MHz)
Fig. 4.2
Performance and ef fi ciency of various processors
3000
8x
ISSCC 2005
ISSCC 2006
ISSCC 2007
ISSCC 2008
4x
SH-X3
1000
8x
FR-V
4x
16x
Cavium
CELL
300
16x
8x
Niagara
4x
PAsemi
Merom
3
rd
G SPARC
100
POWER6
Opteron
PPC970
Itanium
SPARC v9
30
Xeon
4x
1000
3000
10000
30000
1x, 2x, 4x, 8x, or 16x of Operating Frequency (MHz)
Fig. 4.3
Some multicore chips presented at ISSCC
embedded and server/PC processor categories. There are two types of multicore
chips. One type integrates multiple-chip functions into a single chip, resulting in a
multicore SoC. This integration type has been popular for more than ten years. Cell
phone SoCs have integrated various types of hardware intellectual properties
(HW-IPs), which were formerly integrated into multiple chips. For example, an
SH-Mobile G1 integrated the function of both the application and baseband proces-
sor chips [
3
], followed by SH-Mobile G2 [
4
] and SH-Mobile G3 [
5,
6
] , which
enhanced both the application and baseband functionalities and performance. The
other type has increased number of cores to meet the requirements of performance
and functionality enhancement. The RP-1, RP-2, and RP-X are the prototype SoCs,
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