Digital Signal Processing Reference
In-Depth Information
standard formats [17]. There are even integrated circuits that incorporate RF and power management
blocks on the same chip using deep sub-micron CMOS technology [18].
References
1. G. E. Moore, “Cramming more components onto integrated circuits,” Electronics, vol. 38, no. 8, April 1965.
2. G. E. Moore, in Plenary Address at ISSCC, 2003.
3. S. Borkar, “Design perspectives on 22-nmCMOS and beyond,” in Proceedings of Design Automation Conference,
2009, ACM/IEEE, pp. 93-94.
4. www.xilinx.com
5. www.altera.com
6. www.atmel.com
7. www.latticesemi.com
8. www.actel.com
9. www.quicklogic.com
10. www.arm.com/products/system-ip/amba/amba-open-specifications.php
11. A. Landry, M. Nekili and Y. Savaria, “A novel 2-GHz multi-layer AMBA high-speed bus interconnect matrix for
SoC platforms,” in Proceedings of IEEE International Symposium on Circuits and Systems, 2005, vol. 4, pp.
3343-3346.
12. W. Wolf, A. A. Jerraya and G. Martin, “Multiprocessor system-on-chip (MPSoC) technology,” IEEE Transactions
on Computer-Aided Design of Integrated Circuits and Systems, 2008, vol. 27, pp. 1701-1713.
13. S. V. Tota, M. R. Casu, M. R. Roch, L. Macchiarulo and M. Zamboni, “A case study for NoC-based homogeneous
MPSoC architectures,” IEEE Transactions on Very Large Scale Integration Systems, 2009, vol. 17, pp. 384-388.
14. R. C. Chang and B.-H. Lim, “Efficient IP routing Table VLSI design for multi-gigabit routers,” IEEE Transactions
on Circuits and Systems I, 2004, vol. 51, pp. 700-708.
15. S. A. Khan, M. M. Saqib and S. Ahmed, “Parallel Viterbi algorithm for a VLIWDSP,” in Proceedings of ICASSP,
2000, vol. 6, pp. 3390-3393.
16. M. M. Rahmatullah, S. A. Khan and H. Jamal, “Carrier-class high-density VoIP media gateway using hardware/
software distributed architecture,” IEEE Transactions on Consumer Electronics, 2007, vol. 53, pp. 1513-1520.
17. B. Baggini, “Baseband and audiomixed-signal front-end IC for GSM/EDGE applications,” IEEE Journal of Solid-
State Circuits, 2006, vol. 41, 1364-1379.
18. M. Hammes, C. Kranz and D. Seippel, “Deep submicron CMOS technology enables system-on-chip for wireless
communications ICs,” IEEE Communications Magazine, 2008, vol. 46, pp. 151-161.
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