Digital Signal Processing Reference
In-Depth Information
Patterns and environmental configurations identified during simulation can
be used to test actual hardware during DVT and debug.
•
SI analysis identifies design vulnerabilities in the design and shows where the
debug activities should be targeted.
•
References
[1]
Huang, C. C., “Signal Integrity Modeling and Simulation Tools,”
Proceedings of Design-
Con
, 2004.
[2]
Beal, W., “Use the Right Models for the Simulation of Multi-Gigabit Channels,”
Proceed-
ings of DesignCon
, 2004.
[3]
Ramakrishnan, P., “CDNLive! Paper—Signal Integrity (SI) for Dual Data Rate (DDR) Inter-
face,”
Cadence Designer Network
, Silicon Valley, 2007.
[4]
Chandrakasan, A., et al.,
Design of High-Performance Microprocessor Circuits
, New
York: IEEE Press, 2001.
[5]
Pompl, T., and M. Kerber, “Failure Distributions of Successive Dielectric Breakdown
Events,”
IEEE Transactions on Device and Materials Reliability
, Vol. 4, No. 2, June 2004.
[6]
Leblebici, Y., and S. M. Kang,
Hot-Carrier Reliability of MOS VLSI Circuits
, Boston, MA:
Kluwer Academic Publishers, 1993.
[7]
Dillinger, T. E.,
VLSI Engineering
, Upper Saddle River, NJ: Prentice-Hall, 1988.
[8]
Groeseneken, G, “Hot Carrier Degradation and ESD in Submicrometer CMOS Technolo-
gies: How Do They Interact?”
IEEE Transactions on Device and Materials Reliability
, Vol.
1, No. 1, March 2001.
