INTRODUCTION TO PROCESSING OF BIOMATERIALS - Advanced Biomaterials: Fundamentals, Processing, and Applications - page 261

Grooves and Pits Photolithography and anisotropic

etching

Titanium - coated epoxy
replicas of silicon
original

V - shaped grooves
35 - 165

—

μ m width

30 - 120 m depth

V - shaped pits 35 - 270

μ

μ m width

and 30 - 120 μ m depth

Ridges Photolithography and reactive ion

etching

Polystyrene cast of
silicon original

0.5 - 100.0 μ m width
0.03 - 5.0 μ m height

—

Evaporative coating Silicon oxide on

Polystyrene

4 μ m width
50 nm height

Steps Photolithography and reactive ion

etching

PMMA 1 - 18 μ m steps —

Waves Solution polymerization PDMS gels of varying

softness

Softer gels had smaller waves
while hard gel had larger waves

—

Wells and Nodes Photolithography and etching PDMS replicas of

silicon original

2, 5 μm diameter round
nodes, 0.38 and 0.46 μ m high
respectively 8 μm round well,
0.57 μ m deep

—

Laser modifi cation Polycarbonate,

polyetherimide

Square nodes
7, 25, or 50

μ m width

0.5, 1.5, 2.5 μ m height

Pillars and Pores Laser ablation used in conjunction

with masks made by electron-
beam lithography, reactive ion
etching

PMMA, PET,
polystyrene

Circular pillars and pores
1 - 50

—

μ m diameter

Pores Micro porous fi lter: Nylon dip-

coated with PVC/PAN copolymer

Uncoated and silicon
coated fi lters

—

0.2 - 10 μ m diameter

Spheres Particle settling Poly(NIPAM) particles

on polystyrene surface

0.86 - 0.63 m diameter when

temperature raised from 25 to
37 ° C

μ —

Cylinders Fiber - optic light conduit - fused

quartz cylindrical fi bers placed on
agarose - covered cover slips

Fused quartz 12 - 13 or 25 μ m radii —