Biomedical Engineering Reference
In-Depth Information
The cost of a single foundry prototype run, including mask generation,
is generally between thirty and fifty thousand dollars depending upon the
process required [100]. Although this is expensive, twenty to thirty designs
can be integrated on one mask so that the cost per MMIC design may be as
low as two to three thousand dollars. Once in production, the cost per wafer
will drop by more than an order of magnitude. A failure rate of one GaAs
FET per 2 × 10 6 h may be expected for newer medium-integration products
[101]. This rate is lower than the failure rate for discrete GASFETs. This result
is in accordance with trends established for silicon ICs [102]. At 125°C chan-
nel temperature, and with current densities within the limits of the design
rule checker, the failure rate of a standard MMIC design should be less than
0.01% per 1000 h [103].
As technical advances in this arena continue, submicron capability
becomes cost effective. Submicron gate length FETs promise lower noise
figures and increased sensitivity of microwave receivers. By increasing the
standard wafer size and tightening manufacturing process controls, higher
yields per wafer and lowered MMIC cost are realized. Integration of HEMT
processing into the MMIC arena aids in the expansion of MMICs into the
millimeter wave frequency band.
5.12 EmergingCommercialDevicesandApplications
Dozens of companies worldwide are currently offering integrated optical
circuits and components. Many operate pilot production lines for a wide
range of components. (Use of pilot production or foundry facility for devel-
opment of custom OICs was discussed in an earlier section.) Many of these
companies are already well established in the related materials, optical com-
munications, and defense system technologies. The components in the mar-
ket target a wide range of applications, including the following:
• Telecommunications (line-of-sight and fiber optic)
• Optical computing
• Laser range finding
• Optical proximity fusing
• Fiber sensors
• Target designation and tracking
• Industrial measurement and control
• Optical interconnects
• Medical instrumentation
 
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