Hardware Reference
In-Depth Information
% OF SAMPLES
in fabrication lot
I
DDQ
Test Threshold
I
DDQ
1 nA
10 nA
100 nA
1 uA
10 uA
100 uA
1 mA
NON DEFECTIVE
DEFECTIVE
Fig. 2.15
100
1
0.2
0.3
Gate lengh (µm)
be considered nominal anymore but ranging within a statistical distribution (
Ferre
and Figueras
2002
). Assuming also a statistical distribution for defective devices,
only a clear distinction between defect-free and defective devices could be made
if both distributions are far enough. However, this is far from reality as shown in
Fig.
2.15
where the histogram of the current consumption for a real fabricated lot of
circuits illustrates the fact that the defect-free circuits consumption overlap the de-
fective circuits consumption (
Figueras and Ferre
1998
). Indeed, the leakage current
increases in an exponential way for every new CMOS technology node, as described
current mean value of the distribution of the fault-free devices increases and gets
closer to the mean of the defective devices, overlapping both distributions. Thereby,
it becomes more difficult to determine whether a variation in the I
DDQ
value is due
to the leakage current or due to a defect.
2.3.3.2
Other Quiescent Current Testing Techniques
Some techniques based on the post-processing of I
DDQ
data have been developed
to extend the effectiveness of I
DDQ
. One of these techniques is the so-called 'Delta