Information Technology Reference
In-Depth Information
100000
10000
1000
100
10
1
1
3
5
7
9
11
13
15
Layer
17
19 21
23
25
27
29
Inner window
Outer window
Figure
17.12.
Horizontal window availability and vertical window availability
versus quantity of metal layers in a log-scaled version. (MPU interconnect
technology requirements in 2006.)
6000
5000
4000
3000
2000
1000
0
147 0 3 6
Layers
19
22
25
28
2D design
Flip-chip design
Figure
17.13.
2D design versus flip-chip design given the same core area. (MPU
interconnect technology requirements in 2006.)
Search WWH ::
Custom Search