Biomedical Engineering Reference
In-Depth Information
TABLE 7.1
Bioceramic Coatings on Ti Substrate by PVD
Film
Thickness
(
μ
m)
Processesand
Advantages
Substrate
Target
PhaseofCoating
Reference
Electron beam
evaporation (EBD)
Wide variety of target
materials
Ti-6Al-4V
Hot-pressed
HAp + CaO
HAp + β-TCP +CaO
(heat-treated at 903 K
for 3.6 ks)
0.6
(12)
Radiofrequency (RF)
magnetron
sputtering
Commonly applied
in industry
Uniformity in coating
on large area
Ti-6Al-4V
Plasma-spray
coated HAp
layer
Apatite, amorphous
calcium phosphate
(ACP)
0.5-10
(13)
CP Ti
Plasma-sprayed
HAp disk
Apatite (heat-treated
in Ar at 573-973 K up
to 86.4 ks)
2.5
(14)
CP Ti
Hot-pressed
β-TCP
ACP, oxyapatite (OAp),
ACP + OAp
0.5-2
(15)
Ion beam deposition
(EBD + IB)
Strong adherence to
substrate
Ti-6Al-4V
Hot-pressed
HAp
HAp, β-TCP
(heat treated at 903 K
for 3.6 ks)
0.6
(12)
CP Ti
HAp
ACP (as-deposited)
HAp (heat-treated in
air at 873 K for 3.6 ks)
1.3
(16)
Ion beam deposition
(sputtering + IB)
Strong adherence to
substrate
Ti-6Al-4V
70% HAp + 30%
β-TCP
ACP (as-deposited)
HAp (heat-treated in
air at 773 K for 7.2 ks)
0.3
(17)
Pulsed laser
deposition
Wide variety of gas
composition
Coating composition
close to target
CP Ti
Sintered HAp
HAp
(substrate temperature:
773-873 K)
10
(18)
Ti-6Al-4V
Sintered HAp
HAp
(substrate temperature:
758 K)
0.83
(19)
Ti-6Al-4V
Compressed
HAp
<5
(20)
HAp + α-TCP + TTCP
(substrate temperature:
848 K)
Ion plating
High deposition rate
Ti-6Al-4V
HAp
HAp (heat-treated in air
at 773 K for 14.4 ks)
1-5
(21)
TABLE 7.2
Bioceramic Coatings on Ti Substrate by CVD
Phaseof
Coating
FilmThickness
(
μ
m)
Processes
and
Advantages
Substrate
SourceMaterial
Reference
Thermal CVD
High deposition rate
CP Ti
Ca(dpm)
2
,
Ti(O-i-Pr)
2
(dpm)
2
,
(C
6
H
5
O)
3
PO
CaTiO
3
,
α-TCP, HAp
<5
(22)
Laser CVD
Extremely high deposition
rate
Relatively low deposition
temperature
CP Ti
Ca(dpm)
2
,
(C
6
H
5
O)
3
PO
HAp, β-TCP,
TTCP
< 10
(23)
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