Biomedical Engineering Reference
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Fig. 6.32
HRTEM image of
the polycrystalline
YBa
2
Cu
3
O
7
prepared using
the ion milling technique,
showing (1) a selective
thinning at a grain boundary,
where the grains present a
strong disorientation and
contain an intergranular
phase, and (2) damage from
irradiation under the electron
beam (
J. Ayache,
CNRS-UMR8126-IGR,
Vi l lejui f
)
Fig. 6.33
Bright-field TEM
image of a Cu/SiO
2
/Si sample
prepared cross-sectionally
using the tripod polishing
technique, followed by ion
bombardment in single
sectorial rotation. Copper (1)
is not found in the bottom of
the gaps (2). The dark lines
behind the gaps (3) are
thicker regions, resulting
from the abrasion
redeposition of Cu (
D. Laub,
F. Cosandey, Rutgers
University, Piscataway, NJ,
USA
)
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