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Fig. 6.27 True stress plot for a uniform temperature input of 22, 200, and 250 °C (experiment
vs. simulation)
temperatures. Additionally, the simulations using the derived models matched the
experimental data.
6.2.3.4 Non-uniform Temperature Distribution Input
The previous thermal modeling section has shown that large thermal gradients can
exist along the length of a tensile sample during forming during EAF. As a result,
the capability of this deformation/strength model allows for the prediction of local
strain in each element and the overall forming force to deform the material.
6.2.3.5 EAF Diffuse Thermal Model Results (Parameter Set 4)
To simulate EAF forming conditions, the temperature distribution output from the
diffuse deformation model in the previous thermal modeling section is used to be
the input to the deformation/strength model in this section. The results below are
presented for Parameter Set 4 (500 A for 1 s every 60 s) to maintain consistency
with the results presented in the thermal modeling section. The thermal input to
the model is given in Fig. 6.28 where the temperature increases quickly as the cur-
rent is applied and then cools after the current is discontinued. Each of the tem-
perature rises on the figure represents an applied electrical pulse. Also, since the
thermal model assumed a diffuse geometry from experimental measurement, the
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