MEMS and Nanotechnology

Terahertz Metamaterial Structures Fabricated by PolyMUMPs (MEMS and Nanotechnology)

ABSTRACT We present a novel approach for the fabrication of terahertz (THz) metamaterial structures utilizing PolyMUMPs, a foundry process commonly used in the fabrication of microelectricalmechanical systems (MEMS) devices. The structure has an alternating composition consisting of three polysilicon layers and two silicon dioxide layers each with a unique thickness. A split ring resonator (SRR) […]

Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths (MEMS and Nanotechnology)

Abstract Investigations are made into the characterization of 1D metamaterials consisting of stacks of metal and dielectric. These stacks are modeled and designed to have a permittivity approaching zero. Simulation, fabrication and testing are conducted to verify the design of the layered material. These stacks are fabricated using magnetron sputtering and tested using Fourier Transform […]

MEMS integrated metamaterials with variable resonance operating at RF frequencies

ABSTRACT Metamaterials are engineered materials with integrated structures designed to produce a resonant response at specific frequencies. The capacitive and inductive properties of metamaterials effect the overall refractive index of the media in which an RF signal propagates by generating a resonant frequency response. Incorporating microelectromechanical systems (MEMS) into the structure adds the ability to […]

Creep measurements in free-standing thin metal film micro-cantilever bending (MEMS and Nanotechnology)

Abstract Creep is a time-dependent deformation mechanism that affects the reliability of metallic MEMS. Examples of metallic MEMS are RF-MEMS capacitors/switches, found in wireless/RF applications. Proper modeling of this mechanism is yet to be achieved, because size-effects that play a role in MEMS are not well understood. To understand this better, a methodology is setup […]

MEMS Reliability for Space Applications by Elimination of Potential Failure Modes through Analysis

ABSTRACT As the design of Micro-Electro-Mechanical System (MEMS) devices matures and their application extends to critical areas, the issues of reliability and long-term survivability become increasingly important. This paper reviews some general approaches to addressing the reliability and qualification of MEMS devices for space applications. The failure modes associated with different types of MEMS devices […]

Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies Part 1 (MEMS and Nanotechnology)

Abstract Increased demands on large scale server system packaging density have driven the need for new, more challenging electronic component cooling solutions. One such application required the development of a large form-factor printed circuit board assembly with multiple power transformer devices to be cooled via a common heat spreader. Thermally coupling the multiplicity of devices […]

Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies Part 2 (MEMS and Nanotechnology)

Empirical evaluation techniques: Experiments were performed on prototype hardware to characterize detailed part dimensions, assembly tolerances and assembly forces. With regards to part characterization, investigations included non-contact laser scanning measurements of part details and assemblies, part flatness measurements during subassembly construction, TIM gap measurements, PCB board strain measured through assembly operations, each completed during global […]

Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire (MEMS and Nanotechnology)

The interest in light-emitting diodes (LEDs) for illumination applications has been increasing continuously over the last decade due to two key attributes of long lifetime and low energy consumption compared to the conventional incandescent light and compact fluorescent light. Although LEDs are attractive for lighting applications due to the aforementioned advantages, unique technical challenges, such […]

Direct Determination of Interfacial Traction-Separation Relations in Chip-Package Systems (MEMS and Nanotechnology)

ABSTRACT Microelectronic devices are multilayered structures with many different interfaces. Their mechanical reliability is of utmost importance when considering the implementation of new materials. The cohesive interface modeling approach has the capability of modeling crack nucleation and growth, provided interfacial parameters such as strength and toughness of the system are available. These parameters are obtained […]

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