EFFICIENCY AND EVALUATION - Total-Reflection X-Ray Fluorescence Analysis and Related Methods - page 415

Figure6.11. Worldwide distribution of TXRF instrumentation after a survey of conference
attendees in 2013. The maps are shown in Robinson projection. (a) The red bars represent
TXRF instrumentation in 54 countries. (b) TXRF equipment as shown in Figure 6.11a with red
bars, but accumulated in 24 subregions according to the United Nations. The blue bars show
synchrotron beamlines with TXRF facility, and the green bars stand for semiconductor fabs that
probably apply TXRF for contamination control. The height of the bars is a measure for the number
of devices. Red, blue, and green bars are scaled so that their total sum is equalized. Maximum for
TXRF instruments is 34 in Europe, for the beamlines it is 10 in the USA, and for the semiconductor
fabs it is 28 in Taiwan.
Germany, Japan, France, and Singapore with about 5% each. A single plant
costs about US $1 billion (10 9 US$). Most of these fabs have been working since
about 2000 and have a capacity between 10 000 and 80 000 wafers per month. If
30 000 wafers of 300 mm diameter were produced per month, each appropriate
for 1000 chips then US$10 per chip would lead to US $3.6 billion sales per year
and fab. A 1 h stop of a manufacturing plant means a loss of US $400 000.
This group of potential TXRF users is shown in Figure 6.11b as green
bars. The number of fabs was taken from the Internet showing a list of 152
plants in 18 countries or 8 subregions ( http://en.wikipedia.org/wiki/List_
of_semiconductor_fabrication_plants ). The fabs were assumed to have two