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Figure 7.7 Dynamic memory array organization
As discussed before, appropriate internal organization of a memory subsystem
can lead to a saving in the number of IC pins required, an important IC design
factor. In order to reduce the number of pins required for a given dynamic
memory subsystem, it is a normal practice (as in the case of static memory) to
divide the address lines into row and column address lines. In addition, the row
and column address lines are transmitted over the same pins, one after the other
in a scheme known as time-multiplexing. This can potentially cut the number of
address pins required by half. Due to time-multiplexing of address lines, it w ill be
necessary to add two e xtra control lines, that is, row address strobe (RAS) and
column address strobe (CAS). These two control lines are used to indicate to the
memory chip when the row address lines are valid and when the column address
lines are valid, respectively. Consider, for example, the design of a 1M
1 dynamic
memory subsystem. Figure 7.8 shows a possible internal organization of the
memory cell array in which the array is organized as a 1024
1024.
It should be noted that only 10 address lines are shown. These are used to multi-
plex both the rows and columns address lines; each is 10 lines. The rows and col-
umns latches are used to store the row and column addresses for a dur ation equal
to the memory cycle. In th is ca se, a memory access will consist of a RAS and a
row address, followed by a CAS and a column address.
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