Environmental Engineering Reference
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Fig. 10.12 Schematic presentation of an electrocaloric cooling device with a solid matrix, a After
the polarization, the solid matrix is in thermal contact with the heat sink and the multilayer module
rejects heat to the solid matrix, b After the depolarization the solid matrix is in thermal contact with
the heat source and the multilayer module absorbs heat from the solid matrix (see also Gu et al.
[ 54 ])
At the end of 2013, Chukka et al. [ 55 ] presented a paper describing an elect-
rocaloric device for active cooling. Their investigation was focused on how to
reduce the time needed to cool down a chip-sized object to ambient temperature.
A schematic presentation of the system under investigation is shown in Fig. 10.13 .
In the middle of a sandwich-like structure, there is an electrocaloric plate made out
of a bulk PMN-70PT single-crystal ceramic material that exhibits a maximum
adiabatic temperature change of 2.7 K under an electric
eld change of 1.2 MVm 1 .
On each side of the electrocaloric material, a Peltier element (used as a temperature
sensor) was placed to form a sandwich-like structure. On the top side of the
sandwich-like structure, a copper block was placed and this functioned as a heat
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