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The other design concern with 6T SRAM cell is the read/write conflict, wherein a
transistor sizing to enhance the read-stability degrades the write-ability and vice-
versa. The measured result also shows that the use of high- k spacers can mitigate
read/write conflict. The read/write stability is not directly dependent on the absolute
value of I on [11]. Apparently; SNM has a negative correlation with DIBL [12]. In
agreement to this, it is observed that the SNMs are considerably improved using high-
k spacers without affecting cell ratio and pull-up ratio.
5
Conclusion
This research paper presents the effect of underlap length for different spacer mate-
rials on device performance parameters such as drive-current, leakage current and
their ratio. The fringe capacitance component (included in total-gate capacitance) and
the relative change in a drive current-to-capacitance are also investigated that helps to
optimize circuit delay. SRAM performance as a function of varying underlap and
spacer materials are clearly depicted in the paper. Considering the SRAM discussion,
we conclude that for high- k spacer and the underlap length near about 4nm
provides superior performance improvements and thereafter, the cell designs metric
degrades.
References
1. Yang, J.W., Zeitzoff, P.M., Tseng, H.H.: Highly manufacturable double-gate FinFET with
gate-source/drain underlap. IEEE Trans. Electron Devices 54(6), 1464-1470 (2007)
2. Bansal, A., Paul, B.C., Roy, K.: Impact of gate underlap on gate capacitance and gate
tunneling currents in 16nm DGMOS devices. In: IEEE SOI Conference, pp. 94-95 (2004)
3. Trivedi, V., Fossum, J.G., Chowdhury, M.M.: Nanoscale FinFETs with gate-source/drain
underlap. IEEE Trans. Electron Devices 52(1), 56-62 (2005)
4. Pal, P.K., Singh, P., Anand, B., Kaushik, B.K., Dasgupta, S.: Performance analysis of
dual- k spacer at source on underlap FinFETs. In: Proc. Annual IEEE India Conf., Kochi,
India, pp. 915-919 (2012)
5. International
Technology
Roadmap
for
Semiconductors
(2012),
http://public.itrs.net
6. Choi, Y.K.: FinFET process refinements for improved mobility and gate work function
engineering. IEDM Technical Digest, 259-262 (2002)
7. Sentaurus TCAD User Manual, Synopsys, Inc. (2010), http://www.synopsys.com
8. Sachid, A.B., Manoj, C.R., Sharma, D.K., Rao, V.R.: Gate fringe induced barrier lowering
in underlap FinFET structures and its optimization. IEEE Electron Device Lett. 29(1),
128-130 (2008)
9. Rabaey, J., Chandrakasan, A., Nikolic, B.: Digital Integrated Circuits, ch. 10. Prentice-
Hall, Upper Saddle River (2002)
10. Seevinck, E., List, F.J., Lohstroh, J.: Static-noise margin analysis of MOS SRAM cells.
IEEE Journal of Solid-State Circuits 22(5), 748-754 (1987)
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