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having MWCNTs with 5-shells, the difference between minimum and maximum
number of conducting channels is lesser in comparison to the bundle having
MWCNTs with 5- and 15-shells as observed from Table 3. The minimum difference
in conducting channels reveals to the minimum difference in interconnect parasitics
for the bundle having MWCNTs with 10-shells. Therefore, the bundle having
MWCNTs with 10-shells exhibits higher crosstalk deviation in comparison to the
bundle having MWCNTs with 5- and 15-shells.
5
Conclusion
This research paper presented an analytical model of bundled MWCNT that uses the
total number of conducting channels to model the interconnect parasitics. To analyze
the crosstalk delay, the equivalent RLC line of bundled MWCNT has been used to
represent the capacitively coupled interconnect lines. Monte Carlo simulations are
performed to analyze the average crosstalk deviation for process induced bundle
heights and widths variations. Using Gaussian distributed bundle widths and heights,
it has been observed that the average crosstalk deviation reduces for the bundle
having MWCNTs with higher number of shells.
References
1. Ijima, S.: Helical microtubules of graphite carbon. Nature 354, 56-58 (1991)
2. Li, H., Xu, C., Srivastava, N., Banerjee, K.: Carbon Nanomaterials for Next-Generation
Interconnects and passives: Physics, Status, and Prospects. IEEE Trans. Electron
Devices 56(9), 1799-1821 (2009)
3. Srivastava, N., Banerjee, K.: A comparative scaling analysis of metallic and carbon
nanotube interconnects for nanometer scale VLSI technologies. In: Proc. Int. VLSI
Multilevel Interconnect Conf., pp. 393-398 (2004)
4. Srivastava, N., Banerjee, K.: Interconnect challenges for nanoscale electronic circuits.
TMS J. Mater. 56(10), 3-31 (2004)
5. International Technology Roadmap for Semiconductors (2005),
http://public.itrs.net
6. Im, S., Srivastava, N., Banerjee, K., Goodson, K.E.: Scaling analysis of multilevel
interconnect temperatures for high performance ICs. IEEE Trans. Electron Devices 52(12),
2710-2719 (2005)
7. Steinhogl, W., Schindler, G., Steinlesberger, G., Traving, M., Engelhardt, M.:
Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm
and smaller. J. Appl. Phys. 97(2), 023706-1-023706-7 (2005)
8. Dadgour, H., Cassell, A.M., Banerjee, K.: Scaling and variability analysis of CNT-based
NEMS devices and circuits with implications for process design. In: Proc. IEEE IEDM
Tech. Dig., pp. 529-532 (2008)
9. Wei, J.Q., Vajtai, R., Ajayan, P.M.: Reliability and current carrying capacity of carbon
nanotubes. Appl. Phys. Lett. 79(8), 1172-1174 (2001)
10. Collins, B.G., Hersam, M., Arnold, M., Martel, R., Avouris, P.: Current saturation and
electrical breakdown in multiwalled carbon nanotubes. Phys. Rev. Lett. 86(14), 3128-3131
(2001)
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