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3.1
Proposed Macromodel Structure
Fig. 5 shows the proposed macromodel structure that is composed of physically-based
equivalent model elements [10].
I
pu
and
I
pd
represent the nonlinear output current.
Time-variant coefficients
K
pu
and
K
pd
determine the partial turn-on of the pull-
up/down networks during switching transitions.
C
power
and
C
gnd
represent the nonli-
near parasitic capacitance between the output and the supply rails. Surrogate models
of these model elements are constructed, to capture the effects of supply voltage, ter-
minal voltages, semiconductor process, and temperature.
Fig. 5.
Structural IO buffer macromodel template with surrogate model elements
3.2
Macromodel Construction
The automatic modeling process described in Section 2 was used to construct surro-
gate models for the model elements in Fig. 5. The method is demonstrated with the
single-ended output buffer circuit shown in Fig. 6. The circuit is designed in 180 nm
CMOS process with a 3.3 V normal supply voltage. The threshold voltage variations
Δ
V
th
in the MOS transistors are considered as the main process variations and they are
assumed to be within ±20% of the nominal value
V
th0
. The parameter
P
= Δ
V
th
/
V
th0
is
used to describe the threshold voltage variation. The supply voltage Vs is assumed to
fluctuate within ±30% of the nominal supply (3.3 V) and temperature (
T
) is set in the
range of 0 to 100°C. In the modeling process, those PVT-related parameters are sam-
pled adaptively in their ranges.
Here modeling data was extracted from transistor-level SPICE circuit simulations.
Fig. 7 (a) shows the circuit test-bench to extract the pull-up output current
I
pu
(
V
S
,
V
pu
,
T
, Δ
V
th
). The parameter
V
pu
is defined as the voltage difference between the power
supply rail and the output, and it ranges from
V
CC
to2
V
CC
covering the maximum
reflection case [11]. Transient simulations were performed and the simulation time
was long enough (in this case it was 1 ms with 1 ns step size) to record a stable output
current
I
pu
.
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