Digital Signal Processing Reference
In-Depth Information
[12]
Bissell, C. C., and D. A. Chapman, Digital Signal Transmission , Cambridge, U.K.: Cam-
bridge University Press, 1996.
[13]
Thierauf, S. C., High-Speed Circuit Board Signal Integrity , Norwood, MA: Artech House,
2004.
[14]
Horowitz, M., et al., “High-Speed Electrical Signaling: Overview and Limitations,” IEEE
Micro , Vol. 18, No. 1, January/February 1998, pp. 12-24.
[15]
Proakis, J. G., Digital Communications , New York: McGraw-Hill, 2000.
[17]
Terman, F. E., Radio Engineers Handbook , New York: McGraw-Hill, 1943.
[16]
Haykin, S., and B. Van Veen, Signals and Systems , 2nd ed., New York: John Wiley & Sons,
2002.
[18]
Dally, W. J., Poulton, J., “Transmitter Equalization for 4-Gbps Signaling,” IEEE Micro ,
Vol. 17, No. 1, January/February 1997.
[19]
Turudic, A., et al., “Pre-Emphasis and Equalization Parameter Optimization with Fast,
Worst-Case/Multibillion-Bit Verifi cation,” Design Con 2007 , Santa Clara, CA, January
29-February 1, 2007.
[20]
Chandrakasan, A., et al., Design of High-Performance Microprocessor Circuits , New
York: IEEE Press, 2001.
[21]
Young, B., Digital Signal Integrity , Upper Saddle River, NJ: Prentice-Hall, 2001.
[22]
Simbeor Applications Note #2009_1, “Practical Notes on Mixed-Mode Transformations
in Differential Interconnects,” Simberian Corporation, Seattle, WA, January 2009.
[23]
Marx, K. D., “Propagation Modes, Equivalent Circuits, and Characteristic Terminations
for Multiconductor Transmission Lines with Inhomogeneous Dielectrics,” IEEE Transac-
tions on Microwave Theory and Techniques , Vol. MTT-21, No. 7, July 1973, pp. 450-457.
[24]
Paul, C. R., Introduction to Electromagnetic Compatibility , New York: John Wiley &
Sons, 1992.
[25]
Polar Si9000 Field Solver, Polar Instruments, Inc. Beaverton, OR.
[26]
Djordjevic, A. R., et al., LINPAR for Windows , Norwood, MA: Artech House, 1999.
[27]
Ott, H. W., Noise Reduction Techniques in Electronic Systems , 2nd ed., New York: John
Wiley & Sons, 1988.
[28]
Rainal, A. J., “Transmission Properties of Balanced Interconnections,” IEEE Transactions
on Components, Hybrids and Manufacturing Technology , Vol. 16, No. 1, February 1993,
pp. 137-145.
[29]
Simbeor Application Note #2007_07, “Modeling Differential Via-Holes Without Stitching
Vias,” Simberian Corporation, Seattle, WA, October 2007.
Search WWH ::




Custom Search