Sealants and Adhesives - Thermal Analysis of Construction Materials - page 602

Development of thermal analytical techniques for materials charac-
terization is always in progress. Thermal wave microanalysis for testing of
adhesive bonding has been reported in the literature. [46] This technique is a
reliable tool for non-contact, non-destructive testing of adhesive bonding of
thin-walled materials. The spatial distribution of the adhesive under a metal
foil can be visualized during all stages of the curing process.
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