Biomedical Engineering Reference
In-Depth Information
Hardware risk assessments
Operations
Options
(1)
Laser diodes
(1)
Lasers
(3)
Transmission
medium
LED's
(5)
* Modulators
(2)
Laser diodes
(1)
(1)
APD
photodiode
Detectors
Receivers
(4)
Schottky
photodiode
(5)
Laser
controllers
(6)
* Acousto-
optic
Switches
(2)
(2)
Electro-
optic
Multimode
(1)
Fiber
(1)
(1)
Guided
wave
Single-mode
(4)
Transmission
medium
* Wave guide
(5)
* Broadcast
FIGURE 2.32
Hardware risk assessments.
be noted from the two figures. Many of the options for LSI interconnects are
underdeveloped or have not been applied satisfactorily in application. These
are the options marked with the asterisks in both figures. The ratings that
have been assigned to all of the hardware and architectures are based on the
probabilities of solution to implementation of optical data interconnects for
intraboard and cabinet interconnections.
The development of key technologies has made LSI insertion into systems
feasible using individual commercial components for optical data intercon-
nects. Input and output terminals are dimensionally comparable to present
day bonding pads. Power dissipation for optical elements can be made from
a small fraction of total chip power dissipation and all high-speed data input
and output can be performed by optical means. The conclusion is that opti-
cal interconnects are possible and sensible for intraboard and cabinet-level
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