Biomedical Engineering Reference
In-Depth Information
98.0 µm
36°
54°
~67.4 µm
200.6 µm
2
00.6 µm
1500 µm
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t
= Standard Si
wafer thickness
25.5 mm
~1˝
1/2˝ Approximate
length of grooves
(width of chuck)
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FIGURE 7.8
V-groove chuck for 80 and 125 μm diameter fibers.
3 in. Silicon wafer example
FIGURE 7.9
Cleavage lines yielding about 14 useful chucks, set
of 3 grooves, set spacing, 1.5 mm indicate contin-
ued grooving.
7.5 Bionanotechnology
7.5.1 Introduction
Nanoscale scaffolds may ultimately be utilized for molecular structuring
(ala the classic Drexler versus Smalley debate regarding molecular building
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