Hardware Reference
In-Depth Information
Figure 5-25. Align the processor with the socket and drop it gently
into place
Figure 5-26. Lower the load plate into closed position
Figure 5-27. Press the socket lever down and into locked position
under the latching hook
Figure 5-28. If necessary, use a clean paper towel to polish the
processor surface and remove contaminants
Intel provides a syringe with a premeasured amount of
Dow thermal compound. Remove the cover from the tip
of the syringe, place the tip at the center of the proces-
sor, and expel the entire contents of the syringe onto the
processor surface, as shown in Figure 5-29.
If you ever replace the processor or CPU cooler, do not
reuse the existing thermal compound. Remove the old
thermal compound from the processor surface and heat-
sink base, and polish them clean. If the old thermal com-
pound is tenacious, you can use a hair dryer to warm it
slightly and rub it off. Replace it with new thermal com-
pound. We use Antec Silver thermal compound, but any
approved thermal compound will do.
Figure 5-29. Squirt the contents of the thermal compound syringe
onto the center of the processor surface
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