Hardware Reference
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b
a
V DD
V DD Nominal
V DD Nominal
Pass
Pass
Vmin
Vmin
Fail
Fail
0
5
10
15
20
0
5
10
15
20
Period (ns)
Period (ns)
Fig. 2.18 Shmoo plots of a combinational CMOS circuit with a bridging defect: ( a ) Defect-free
case and ( b ) defective case ( Rodrıguez-Monta nes 2006 )
Fig. 2.19 Shmoo plots for
two inverters with their
outputs bridged together
.Rb D 1 k/. Each inverter
belongs to a different inverter
chain ( Rodrıguez-Monta nes
2006 )
V DD
V DD Nominal
Fail
Vmin
Pass
0
5
10
15
20
Period (ns)
p-bridged networks a shmoo plot like the one in Fig. 2.19 is obtained ( Rodrıguez-
Montanes et al. 2006 ). In this particular example, the bridge is connecting the output
of the inverters.
The main drawback of this technique is the number of ATE measurements re-
quired. Each individual measurement performed on the ATE can result in a pass-fail
(e.g. of a functional test) or in a numerical result (e.g. failure counts or bit error rate).
Some approaches have been proposed to reduce the time required to generate
a Shmoo plot. In this direction, Patten ( 2004 ) proposes a robust and efficient fast
Shmoo algorithm that extracts the device characteristics from a minimum number
of coordinate points that actually have to be measured. This algorithm reduces the
Shmoo execution time significantly.
2.3.3.5
Temperature Based Testing Techniques
Temperature may also give additional information to detect bridges which are
not observable at nominal conditions. Resistive bridges are temperature sensi-
tive because their electrical resistance varies with temperature ( Semenov and
Sachdev 2000 ) . Bridging defect materials having a positive resistance tempera-
ture coefficient (RTC) such as metals and polysilicon increase their resistance
 
 
 
 
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