Biomedical Engineering Reference
In-Depth Information
a
d
Silk
Silk film
Decrease thickness
from 76 µm to 2.5 µm
Change structure
from sheet to mesh
0.3 cm
76 µm
26 µm
e
Cast and dry silk
on PDMS substrate
b
Poor contact
Poor contact
2.5 µm
7.0 µm
Good contact
Good contact
Fabricated device on
carrier wafer
(PI/PMMA/Si)
Dissolve PMMA;
transfer to silk
substrate using silk solution
Connect ACF;
contact to brain;
dissolve silk substrate
f
Mesh
ACF
pad
2 mm
Silk
c
ACF
Silk
0.2 cm
200 ms
0
2
4
6
8
g
Brain
Open skull,
prepare electrode
Contact, pour
saline solution
Dissolve silk,
conformal contact
200 ms
