Biomedical Engineering Reference
In-Depth Information
The DSC curve of the microcapsule is shown in Figure 4. The endothermic peak at
115.7°C corresponds to melting of UF resin and at 199.4°C corresponds to melting of
alkyd resin whereas at 147.4°C it corresponds to evaporation of solvent xylene. Devia-
tions in the base line are said to be glass transition temperature
Figure 4. DSC curve.
shell Wall morphology
Scanning electron microscopy was performed to analyze capsule surface morphology
and shell wall thickness. Figure 5 shows a resin-solvent filled microcapsule with rough
exterior shell wall and size in the range of 450 µm.
Figure 5. SEM image of a microcapsule.
 
 
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