Biomedical Engineering Reference
In-Depth Information
ACKNOWLEDGMENTS
Part of the research summarized in this chapter has been conducted at the Center of Excellence for
Advanced Materials (CEAM) at the University of California, San Diego under the support of ARO/
DARPA DAAD19-00-1-0525 contract to UCSD. The authors wish to thank Dr. Leo Christodoulou
and Dr. John Venables of the DARPA Defense Science Office of for helpful guidance and encour-
agement. Research on the integration of sensing in composites is currently supported by the NSF under
grant CMS-0330450. Dr. Shi-Chi Liu is gratefully acknowledged for his support and encouragement.
NOTES
1.
We keep the additional numerical correction factor 2 (1 þ ln p ) that Pendry usually drops because we
typically employ this formula for values of d and r that do not follow the assumption that ln( d/r ) >> 1.
2.
Hughes Circuits, 540 S. Pacific St, San Marcos, CA 92069-4056.
3.
1-Wire is registered by its developer Dallas Semiconductor, who has subsequently been acquired by
Maxim Integrated Products.
4.
Maxim Integrated Products, Inc., 120 San Gabriel Drive, Sunnyvale, CA 94086.
5.
CF100 from LPKF Lasers and Electronics, North America, 28880 SW Boberg Rd, Wilsonville, OR 97070.
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