Environmental Engineering Reference
In-Depth Information
Cl 2 to the Al, and slows the chemical process. But as a result of ion bombardment,
the chlorocarbon protective film is destroyed, and chemical reactions between Cl
or Cl 2 and Al proceed at such locations until a chlorocarbon film again forms there.
This provides an anisotropy of the etching process due to the vertical direction of
the ions. Thus, this process combines selectivity and anisotropy. Using a radio-
frequency discharge in low-density chlorine with an admixture of chlorocarbons,
one can obtain simultaneously an ion beam that is formed on the plasma boundary
due to the plasma sheath, chemically active Cl and Cl 2 particles, and material for a
polymer film.
Etching is one of the stages of the microfabrication process (Figure 7.3). In ad-
dition, the photoresist must be removed, and structures may be deposited in the
etched areas by other materials. Plasma processes may be useful here also. In par-
ticular, a simple technique for photoresist removal is based on its reaction with
oxygen atoms that can be obtained from a gas discharge plasma. The analysis of
the etching process shows the complexity of plasma application methods. Because
of the variety of possible plasma systems and methods for any particular applied
problem, the choice of the optimal scheme, method, or regime depends on certain
requirements and conditions. In conclusion, we note that this description of plas-
ma applications has a schematic character and cannot give details of this plasma
area.
References
1 Ochkin, V.N., Preobrazhensky, N.G. and
Shaparev, N.Ya. (1998) Optohalvanic Ef-
fect in Ionized Gas ,GordonandBreach,
London.
2 Ochkin, V.N. (2009) Spectroscopy of Low
Temp e r a t u r e P l a sma ,Wiley-VCHVerlag
GmbH.
3 Chen, F.F. (1984) Introduction to Plasma
Physics and Controlled Fusion ,Plenum,
New York.
4 Stuhlinger, F. (1964) Ion Propulsion for
Space Flight , McGraw-Hill, New York.
5 Jahn, R.G. (1968) Physics of Electric
Propulsion , McGraw-Hill, New York.
6 Brewer, G.R. (1970) IonPropulsionTech-
nology and Applications ,Gordonand
Breach, New York.
7 Grishin, S.D. and Leskov, L.V. (1989)
Electrical Rocket Engines of Space Vehicles ,
Mashinostroenie, Moscow, in Russian.
8 Goebel, D.M. and Katz, I. (2008) Funda-
mentals of Electric Propulsion ,JohnWiley
& Sons, Inc., Hoboken.
9 Boulos, M.I., Fauchais, P., and Pfend-
er, E. (1994) Thermal Plasmas ,Plenum,
New York.
10 Rossnagel, S.W., Cuomo, J.J., and West-
wood, W.D. (1990) Handbook of Plasma
Processing Technology ,NoyesPublica-
tions, Park Ridge.
11 National Academy (1995) Plasma Sci-
ence: from Fundamental Research to Tech-
nological Applications ,NationalAcademy
Press, Washington.
12 Chen, F.F. and Chang, J.P. (2003) Lec-
tures Notes on Principles of Plasma Pro-
cessing ,Kluwer,NewYork.
13 Nemchinsky, V.A. and Severance, W.S.
(2006) J. Phys. , 39 , R423.
14 Gomez, E. et al. (2009) J. Hazard. Mater. ,
161 , 604.
15 Lieberman, M.A. and Lichtenberger, A.J.
(2005) Principles of Plasma Discharge and
Materials Processing , John Wiley & Sons,
Inc., Hoboken.
16 D'Agostino, R. (1990) Plasma Deposi-
tion, Treatment, and Etching of Polymers ,
Academic Press, New York.
Search WWH ::




Custom Search