Chemistry Reference
In-Depth Information
Developments focus on further improvements in aluminium alloy composition (i.e.
higher strength, good formability and higher corrosion resistance). Research activities
throughout the industry have resulted in concepts for:
new flux qualities more suitable in dry/electrostatic flux application and for furnace
brazing of Mg-containing alloys (up to 0.6%);
cladless brazing technologies;
prefluxed brazing sheet/ components;
reduction of consumables (e.g. flux, water).
Future developments for flux brazing technology will include manufacturing more heat
exchanger types and extended product ranges, some of which are currently still produced
with other processes and materials.
References
[1] D. T. Meshri, Advanced Inorganic Fluorides: Synthesis, Characterization and Applications,
edited by T. Nakajima, B. Zemva, A. Tressaud, 661-682, Elsevier Science S.A., Amsterdam,
2000.
[2] G. Schiemann, Aromatic fluoro derivatives. XIX. The borofluoride method of preparing
aromatic fluoro derivatives, J. Prakt. Chemie, 140, 97-99 (1934).
[3] A. I. Burmakov, B. V. Kunshenko, L. A. Alekseeva and L. M. Yagupolskii, New Fluorinating
Agents in Organic Synthesis, 197-253, Springer-Verlag, Berlin, 1989.
[4] R.L. Powell and T.A. Ryan, Industrial Inorganic Chemicals and Uses, edited by R. Thompson,
208-209, Royal Society of Chemistry, Cambridge, 1995.
[5] D. Naumann, Fluor und Fluorverbindungen, Spezielle Anorganische Chemie Bd. 2, 3-5,
Dr. Dietrich Steinkopff Verlag, Darmstadt, 1980.
[6] Solvay Fluor GmbH, Hannover, 2006.
[7] J. A. Aigueperse ''Hydrofluoric Acid'', Chapter 1, Fluorine Compounds, Inorganic; Ullmann's
''Encyclopaedia of Industrial Chemistry''; Part 11, Wiley-VCH Verlag Weinheim, 2005.
[8] J. F. Gall. In: Kirk-Othmer; ''Encyclopedia of Chemical Technology'';3
rd
Edition, 10, 733-753
Wiley, New York 1980.
[9] C. S. Wen and Y. T. Yu, Surface characterization of cast Ti-6Al-4V in hydrofluoric-nitric
pickling solutions, Surface and Coatings Technology, 176, 337-343 (2004).
[10] Y. Uozumi, T. Nakajima, T. Matsumura, Y. Yoshimizu and H. Tomita, ''Development of an
Eco-friendly Copper Interconnect Cleaning Process'', Paper from: International Interconnect
Technology Conference, IEEE 2007 4-6, 25-27, Institute of Electrical and Electronics
Engineers (IEEE) 2007.
[11] P. D. H. Short, Etching of glass articles, Glass., 57, 208-211 (1980).
[12] W. C. Nixxon, Jr., Glass Frosting Problems and How to Correct Them, Glass Industry, 66,
14-16, 39 (1985).
[13] Y. S. Lazarev and V. A. Drozhzhinov, Chemical polishing of crystal glass with concentrated
acids, J. Glass and Ceramics, 47, 433-434 (1990).
[14] C. Chang, T. Abe and M. Esashi, Glass etching assisted by femtosecond pulse modification,
Journal Sens. Mater., 15, 137-145 (2003).
[15] M. Bu, T. Melvin, G. J. Ensell, J. S. Wilkinson and A. G. R. Evans, A new masking technology
for deep glass etching and its microfluidic application, Sensors and Actuators A, 115, 476-482
(2004).
[16] A. Somashekhar and S. O'Brien, Etching SiO2 Films in Aqueous 0.49% HF, J. Electrochem.
Soc., 143, 2885 (1996).
[17] D. M. Knotter and T. J. J. Denteneer, Etching mechanism of silicon nitride in HF-based
solutions, J. Electrochem. Soc., 148(3), 43-46 (2001).
