Biomedical Engineering Reference
In-Depth Information
Fig. 8.35 Bright-field TEM image of a cross section prepared using the tripod polishing technique.
This image shows all of the YBa 2 Cu 3 O 7 /SrTiO 3 interfaces in a multilayer material created using
laser ablation and shows regular growth defects. ( J. Ayache, CNRS, CSNM, Orsay )
interfaces (dislocations, stacking faults, etc.) along the surface of the film and over
a great distance along the multilayer material. It can also be used to obtain statistics
on growth defects.
The ion milling technique results in heavy irradiation under the ion beam,
which promotes the diffusion of atoms at the interfaces, as well as in the loss of
crystal defects highlighted by the tripod polishing technique. Furthermore, the inter-
faces are no longer completely observable along the film/substrate interface, either
because of selective abrasion or because of their amorphization (Fig. 8.36) .
Fig. 8.36 Bright-field TEM image of a cross section prepared using the ion bombardment tech-
nique, showing the damage from ion irradiation and the loss of layers in the multilayer material.
( J. Ayache, CNRS, CSNM, Orsay )
With the tripod polishing technique, there is no longer the phenomenon of
annealing under the electron beam. In addition, the structure is stable, which enables
the quantitative chemical analysis of the interfaces.
3.3 Comparison Between Mechanical Preparations
and Electrolytic Preparations
Electrolytic Thinning Techniques (“Techniques” Chapter 3, Section 1) , Tripod
Polishing Technique + Ion Milling Technique (“Techniques” Chapter 4,
Section 3; “Techniques” Chapter 3, Section 5), and Ultramicrotomy
Technique (“Techniques” Chapter 4, Section 4)
Bulk metallic material: ZrNi alloy and ZrNi + CeO (Figs. 8.37, 8.38, 8.39, and
8.40)
 
 
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