Artifacts in Transmission Electron Microscopy - Sample Preparation Topic for Transmission Electron Microscopy - page 138

Fig. 6.2 Bright-field TEM
image of a germanium
cross-section sample
(semiconductor) prepared by
the tripod polishing
technique, showing a tearing
of matter due to directional
mechanical polishing ( white
arrows )( C. Dieker,
EPFL-CIME, Lausanne )
Fig. 6.3 Bright-field TEM
image of a cross-section of a
SiO 2 /Au multilayer on a Si
substrate (mixed-composite
material) prepared by the
tripod polishing technique,
showing: (1) displacement of
gold particles in the resin; (2)
residues of silicon used for
final polishing ( S. de
Chambrier. A. Schüler,
EPFL-LESO, Lausanne )