Biomedical Engineering Reference
In-Depth Information
amorphization of the crystal network, a lattice change, crystallization, or
re-crystallization.
Techniques involved: ion milling and focused ion beam thinning (FIB).
Microstructural change : Partial or total change of the structural organization of
the components of a microstructure that can be caused by ionic effects. It can
result in changes in morphology, redistributions of phases, changes in crystal
structure, precipitation, chemical gradients, formation of new phases, etc.
Techniques involved: ion milling and focused ion beam thinning (FIB).
2.2.1 Secondary Thermal Damage Induced During Ionic Preparation
Fusion : Change of solid-liquid physical state of a solid sample. It can be
caused by an increase in temperature during ionic preparation.
Techniques involved: ion milling and focused ion beam thinning (FIB).
Phase transformation : Total or partial transformation of the crystallographic
and/or chemical structure of a sample, which can be caused by thermal
effects during ionic preparation.
Techniques involved: ion milling and focused ion beam thinning (FIB).
Loss of chemical elements : Selective loss of a chemical element of the sample,
which may be caused by secondary thermal effects during ionic preparation.
Techniques involved: ion milling and focused ion beam thinning (FIB).
Amorphization : Partial or total degradation of the chemical bonds of a crys-
talline sample, leading to its destruction, caused by thermal effects during
the ionic preparation.
Techniques involved: ion milling and focused ion beam thinning (FIB).
Demixing : Separation of partially miscible phases of a mixture or alloy caused
by thermal effects, leading to the exceeding of the solubility limit of one or
more compounds.
Techniques involved: ion milling and focused ion beam thinning (FIB).
2.3 Chemical Preparation-Induced Artifacts
Matter displacement : Transport by creeping of either matter on the sample
surface or a particular phase of a multiphase material, caused by chemical
action.
Techniques involved: electrolytic polishing, chemical polishing, twin-jet elec-
trolytic thinning, full-bath electrolytic thinning, twin-jet chemical thinning,
full-bath chemical thinning, and extractive replica.
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