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Chemical interaction of Fe, Ni and Au with poly(vinyl
chloride) and poly(tetrafluoroethylene) during thermal
evaporation and the effect of post-metallization X-ray
irradiation studied by in situ X-ray photoelectron
spectroscopy
C.C. PERRY, S.R. CARLO, J. TORRES, A.J. WAGNER
and D. HOWARD FAIRBROTHER
Department of Chemistry and Department of Materials Science and Engineering,
The Johns Hopkins University, 3400 N. Charles Street, Baltimore, MD 21218
Abstract—The interaction of Au, Ni and Fe with poly(vinyl chloride) (PVC) and poly(tetrafluoro-
ethylene) (PTFE) during thermal evaporation was investigated using in-situ X-ray photoelectron
spectroscopy (XPS). On PVC, Fe, Ni and Au were all found to be reactive during thermal evapora-
tion, with the extent of reaction varying in the order: Fe > Ni > Au. In contrast, only Fe and Ni
formed metal fluoride bonds on PTFE. The differing metal halide yields on PVC and PTFE have
been rationalized in terms of the relative strengths of the M-X (X = F, Cl) and C-X bonds. In the
Fe/PTFE, Fe/PVC and Ni/PTFE systems, post-metallization X-ray surface modification also in-
creased the yield of metal halides which was postulated to be due to the generation of reactive halo-
gen species.
Keywords : Metallization; physical vapor deposition; X-ray modification; poly(tetrafluoroethylene);
poly(vinyl chloride).
1. INTRODUCTION
The production of metallic thin films on polymeric substrates by vacuum deposi-
tion (metallization) is of both technological and scientific interest. In particular,
developing an understanding of metal/polymer interface is relevant to both mi-
croelectronics and packaging industries where the performance of the metallized
structure depends upon the microscopic nature of the metal/substrate bonding [1,
2]. Thus, for electronic devices such as transistors and capacitors, metal intercon-
nects should exhibit low resistivity and interconnection times. Lower interconnec-
tion times (defined by the product of resistance and capacitance) may be achieved
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