Biomedical Engineering Reference
In-Depth Information
FIGuRE 3.17
A hot embossing platform during use. (Courtesy of the MEMS and Nanotechnology Exchange
at CNRI)
FIGuRE 3.18
SEM of a variety of small test structures made in a plastic substrate using hot embossing tech-
nology at the MEMS and Nanotechnology Exchange. The height of the plastic microstructures
is nearly 300 um, and the smallest features have a diameter of about 25 um. (Courtesy of the
MEMS and Nanotechnology Exchange at CNRI)
Other Micromachining Technologies
In addition to bulk micromachining, surface micromachining, wafer bond-
ing, and high-aspect-ratio micromachining technologies, there are a number
of other techniques used to fabricate MEMS devices. We shall review a few
of the more popular methods in this section, but readers are referred to [9, 10]
for an exhaustive catalog of MEMS processes.
Search WWH ::




Custom Search