Chemistry Reference
In-Depth Information
10 µm
FIGURE 5.7
Scanning electron micrograph of Al-coated SiO
2
particles.
resulting equilibrium temperature may be quite different. Due to a much better
heat conduction along the substrate holder, a Si wafer does not reach as high tem-
peratures as microscopic powder particles that are mainly cooled by radiation.
Hence, the rather high deposition temperature of the powder particles resulting
from the thermal power during the sputter process causes an increased grain size
and rough microstructure.
